Multilayered electronic component and board having the same mounted thereon
US11257623B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Jun 25, 2020 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Jun 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode including an electrode layer disposed on the body and an Sn plating layer disposed on the electrode layer. A thickness of the body is defined as Tb, a thickness of the Sn plating layer is defined as Ts, Tb is 0.22 mm or less, and Ts is 4.5 μm or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.