Patent · US Active

Method of selecting semiconductor chips

US11257705B2 · kind B2 · utility

0Cited by

3References

14Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Daniel Richter · Bad Abbach, DE
Gunnar Petersen · Regensburg, DE
Konrad Wagner · Friedberg, DE

Key dates

Filing date	Jan 24, 2018
Grant date	Feb 22, 2022
Priority date	—
Expiry date	Feb 3, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68381
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.