Method of manufacturing light emitting device, method of manufacturing light emitting module, light emitting device, and light emitting module
US11257800B2 · kind B2 · utility
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21Claims
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Key dates
| Filing date | Jul 1, 2020 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Jul 1, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/856
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a light emitting device includes: providing a plurality of first element structures each including a submount, a light emitting element, and a light transmissive member, in this order; disposing the first element structures on a sheet member such that the submount in each of the first element structures faces the sheet member; and forming a first cover member on the sheet member so as to cover lateral faces of the first element structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.