Flexible organic light-emitting diode (OLED) device of reduced stess at bending place and fabrication method thereof
US11258038B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2019 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Jan 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
Abstract
The present disclosure provides a flexible organic light-emitting diode (OLED) device and a fabrication method thereof, wherein the flexible organic light emitting diode (OLED) device includes a substrate, an array unit layer, a light-emitting device layer, and an encapsulation layer that are sequentially disposed. The encapsulation layer includes a first inorganic layer, a first organic layer and a second inorganic layer that are sequentially disposed. The second inorganic layer has a continuous wavy curved-configuration, and an interface between the second inorganic layer and the first organic layer has a continuous wavy curved-shape. The present disclosure is directed to a flexible OLED device using a novel outer inorganic layer to increase the contact area between the outer inorganic layer and the inner organic layer, thereby effectively reducing risks of breakage of the outer inorganic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.