Electrical circuit board with low thermal conductivity and method of constructing thereof
US11259398B2 · kind B2 · utility
0Cited by
24References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Aug 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/062
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.