Socket with thermal conductor
US11259399B2 · kind B2 · utility
0Cited by
0References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2018 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Jun 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2009
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.