Fabrication of electrical and/or optical crossover signal lines through direct write deposition techniques
US11259402B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2020 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Sep 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) comprises two or more PCB layers comprising of a dielectric core and conductive cladding on adjoining surfaces; one or more DC lines embedded in one or more layers of the two or more PCB layers; one or more RF signal lines embedded in one or more layers of the two or more PCB layers; wherein the one or more DC lines crosses over/under at least one of the RF signal lines to form at least one crossover, wherein the at least one crossover is no thicker than the PCB layer in which it is situated. The printed circuit board of claim 1, further comprising two or more generally parallel DC lines which converge to form a stack of superposed parallel DC lines where the two or more DC lines cross over the one or more RF signal lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.