Patent · US Active

Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device

US11259448B2 · kind B2 · utility

1Cited by
2References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 19, 2020
Grant dateFeb 22, 2022
Priority date
Expiry dateNov 19, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L23/473
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.