Power electronics system having a housing, a cooling device, a power semiconductor module and a capacitor device
US11259448B2 · kind B2 · utility
1Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2020 |
| Grant date | Feb 22, 2022 |
| Priority date | — |
| Expiry date | Nov 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in thermally conducting contact with a cooling surface of the cooling device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.