Method and device for monitoring a joining seam during joining by means of a laser beam
US11260471B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Feb 10, 2017 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jun 6, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K31/125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for monitoring a joining seam, in particular during joining by a laser beam, wherein in the processing direction before a processing point a joining site is measured in order to detect the position and geometry thereof, at least one position of a joining seam is determined from the position of the joining point, and in the processing direction after the processing point the joining seam is measured in order to detect the geometry thereof at the determined position. A device is also provided for carrying out said method and to a laser processing head equipped with such a device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.