Apparatus for reducing fabric dimpling in electronic devices and associated methods
US11260639B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Aug 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2231/001
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present document describes an apparatus for reducing fabric dimpling in electronic devices and associated methods. The apparatus is used during assembly to prevent fabric, which is stretched over a perforated part (e.g., speaker housing), from dimpling into the holes (e.g., perforations) of the perforated part. The apparatus includes protrusions (e.g., pins), which act as a negative of the holes in the perforated part, to support the fabric as it is stretched over the perforated part. In particular, the protrusions are inserted through the perforations via an interior surface of the perforated part such that the protrusions are “proud” (slightly projecting from a surface) with respect to an exterior surface of the perforated part. The proudness of the protrusions may vary based on a degree of curvature of the perforated part at a location corresponding to a respective protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.