Apparatus and method for decoupling an element that is bonded to a surface by adhesive
US11260647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 7, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jul 7, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1967
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatuses and methods for decoupling an element that is bonded to a surface by an adhesive are provided. In one example, the apparatus includes a body, a first spool that is rotationally coupled to the body, and a cable having a first cable end portion that is coupled to the first spool, a second cable end portion that is coupled to the body, and a cable intermediate portion that is disposed between the first cable end portion and the second cable end portion. The apparatus is configured to be positioned adjacent to at least one of the element and the surface with the cable intermediate portion disposed adjacent to the adhesive such that when the first spool is rotated, the cable wraps about the first spool, thereby pulling the cable intermediate portion through the adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.