Polishing composition
US11261346B2 · kind B2 · utility
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12Claims
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Assignee
Inventor
Key dates
| Filing date | Mar 22, 2017 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Aug 16, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1436
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a polishing composition for use in polishing a material having a Vickers hardness of 1500 Hv or higher. The polishing composition comprises an alumina abrasive and water. The alumina abrasive has an isoelectric point that is below 8.0 and is lower than the pH of the polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.