Patent · US Active

Method for molding a body in a mold

US11261349B2 · kind B2 · utility

0Cited by

11References

18Claims

0Family size

Assignee

tesa SE · DE

Inventors

Stephan Bernt · Hamburg, DE
Patrick Kerep · Hamburg, DE

Key dates

Filing date	Jul 14, 2016
Grant date	Mar 1, 2022
Priority date	—
Expiry date	Sep 7, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2483/00
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

Adhesive tape having a carrier material comprising the following layers: a textile composed of fibers having a softening point greater than or equal to 200° C., and coated with fluoropolymers or silicone polymers, to the top side of which textile a first film composed of fluoropolymers is applied over the whole surface and to the bottom side of which textile a second film is applied over the whole surface, wherein a self-adhesive mass is applied to one side of the carrier material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.