Apparatus and method for hybrid opto-electrical multichip module
US11262514B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2019 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Dec 9, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4278
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure relates to a hybrid opto-electrical module apparatus. The apparatus may have a module substrate having a plurality of electrically conductive circuit traces for carrying electrical signals, and at least one waveguide element for carrying optical signals. A waveguide substrate is in optical communication with the waveguide element. A transducer is supported on the waveguide substrate and in electrical communication with the circuit traces. The waveguide substrate has at least one three dimensional (3D) waveguide formed within its interior volume for routing optical signals between the waveguide element and the transducer. A first optical wirebond interfaces the waveguide element to the 3D waveguide, and a second optical wirebond interfaces the 3D waveguide to the transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.