Touch module
US11262878B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Dec 17, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to the field of touch technology, and provides a touch module, which includes a substrate, a first touch sensing layer, a metal wiring layer, and a transparent conductive layer. The substrate has a visible area and a peripheral area located around the visible area. The first touch sensing layer extends from the visible area to the peripheral area of the substrate. The metal wiring layer is located in the peripheral area of the substrate and is laterally separated from the first touch sensing layer. The transparent conductive layer is located in the peripheral area of the substrate and has a first portion and a second portion. The first portion is in contact with the first touch sensing layer and the second portion is in contact with the metal wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.