Electronic device and manufacturing method thereof
US11263420B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Dec 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/198
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An electronic device and a manufacturing method for the electronic device are provided. The electronic device includes a display structure layer and a light sensing panel. The light sensing panel includes a first substrate; a second substrate, wherein the second substrate is disposed between the first substrate and the display structure layer; a plurality of sensing units, disposed on the first substrate and between the first substrate and the second substrate; and an optical structure layer, disposed on the second substrate and between the second substrate and the display structure layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.