Direct write, high conductivity MMIC attach
US11264299B1 · kind B1 · utility
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Sep 3, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Sep 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit assembly including an integrated circuit formed on one side of a substrate and a thermal spreading layer composed of a silver ink directly printed on an opposite side of the substrate from the integrated circuit, where the thermal spreading layer removes heat generated by the integrated circuit. The assembly also includes a heat sink thermally attached to the thermal spreading layer opposite to the substrate, where the heat sink is attached to the thermal spreading layer by printing the same material on the heat sink as the thermal spreading layer and pressing the spreading layer to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.