Patent · US Active

Integrated circuit package with through void guard trace

US11264338B2 · kind B2 · utility

0Cited by

0References

25Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Ananth Prabhakumar · Chandler, US
Krishna Srinivasan · Mahwah, US
Arnab Sarkar · Calabasas, US

Key dates

Filing date	Mar 23, 2018
Grant date	Mar 1, 2022
Priority date	—
Expiry date	Jun 30, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15311
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatuses, systems and methods associated with over void signal trace design are disclosed herein. In embodiments, an integrated circuit (IC) package may include a first layer that has a void and a guard trace, wherein a first portion of the void is located on a first side of the guard trace and a second portion of the void is located on a second side of the guard trace. The IC package may further include a second layer located adjacent to the first layer, wherein the second layer has a signal trace that extends along the guard trace. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.