LED package structure
US11264370B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 11, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jun 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode (LED) package structure includes a substrate, an LED, a side wall, an encapsulant, and a waterproof protective coating. The LED is disposed on the substrate, the side wall defines a through hole and is disposed on the substrate, and the LED is accommodated in the through hole. The encapsulant is filled in the through hole and covers the LED. A heterojunction is disposed between the encapsulant and the side wall, and the waterproof protective coating seals the heterojunction. Furthermore, the encapsulant includes a first fluoropolymer, the waterproof protective coating includes a second fluoropolymer, and the light transmittance of the first fluoropolymer is greater than that of the second fluoropolymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.