Patent · US Active

Integrated circuit package and system using same

US11264527B2 · kind B2 · utility

2Cited by

11References

20Claims

0Family size

Assignee

Medtronic, Inc. · US

Inventors

Mark R. Boone · Gilbert, US
Mark E. Henschel · Phoenix, US

Key dates

Filing date	Oct 1, 2018
Grant date	Mar 1, 2022
Priority date	—
Expiry date	Oct 1, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/853
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.