Light emitting device and method of manufacturing the light emitting device
US11264541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jul 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
Abstract
A light emitting device includes a package having an upper surface and an upward-opening recess defined in a portion of the upper surface, at least one light-emitting element in the recess, a light-transmissive member covering the opening of the recess, and an antireflection film on a lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package via the antireflection film. A coating film is disposed on at least a portion of an outer surfaces of the light emitting device, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the package is exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.