Interposer and substrate incorporating same
US11264688B2 · kind B2 · utility
1Cited by
8References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 23, 2018 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | May 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P11/002
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.