Method for manufacturing an antenna printed circuit board
US11264701B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 22, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Oct 17, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an antenna printed circuit board includes the following steps: providing a flexible-rigid printed circuit board comprising a flexible region and a rigid region. The flexible region comprises at least one first connecting pad and at least one second connecting pad arranged opposite sides of the rigid region. At least one antenna module is attached to the first connecting pad through a conductive paste. The antenna module is fixed on the rigid region by a first reflow soldering process. At least one radio frequency integrated circuit structure is attached to the second connecting pad through a conductive paste. The radio frequency integrated circuit is fixed on the rigid region by a second reflow soldering process. A gap between the antenna module and the rigid region and a gap between the radio frequency integrated circuit structure and the rigid region are filled with dielectric materials and cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.