Solder-free component carrier connection using an elastic element and method
US11264737B2 · kind B2 · utility
0Cited by
5References
11Claims
0Family size
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Key dates
| Filing date | Mar 10, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Mar 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier is illustrated and described. The component carrier has i) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ii) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.