Flip chip backside emitting VCSEL package
US11264780B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 3, 2019 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jul 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/04257
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A flip chip backside Vertical Cavity Surface Emitting Laser (VCSEL) package has a VCSEL pillar array. A first metal contact is formed over a top section of each pillar of the VCSEL pillar array. A second metal contact is formed on a back surface of the VCEL pillar array. An opening is formed in the second metal contact and aligned with the pillars of the VCSEL pillar array. Solder tip is applied on each pillar of the VCSEL pillar array to flip chip mount the VCSEL pillar array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.