Component mounting method and component mounting apparatus
US11266026B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Dec 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0813
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.