Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
US11266027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Jun 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1423
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.