Heatsink for multiple memory modules
US11266046B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2020 |
| Grant date | Mar 1, 2022 |
| Priority date | — |
| Expiry date | Apr 14, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.