Patent · US Active

Debris control apparatus for cutting machines

US11267092B2 · kind B2 · utility

0Cited by
10References
15Claims
0Family size

Inventor

Key dates

Filing dateFeb 21, 2017
Grant dateMar 8, 2022
Priority date
Expiry dateFeb 21, 2037

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T409/304088
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A debris control apparatus comprising a debris control enclosure, the enclosure further comprising a vacuum opening in the enclosure. The vacuum opening being sized, shaped and positioned to receiving a vacuum conduit, connected to a vacuum source, for extracting the debris from the enclosure. The debris control apparatus further comprising a mounting assembly for mounting the enclosure to a machine, such that, during operation, the enclosure moves along the work material as the cutting tool moves along the work material, the enclosure being mounted independent of movement of the cutting tool in and out of the work material. The mounting assembly comprises a depth adjuster for adjusting the operating depth of the enclosure. The depth of the enclosure can be adjusted such that the debris will be contained in the enclosure during operation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.