High throughput polishing system for workpieces
US11267095B2 · kind B2 · utility
0Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2018 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Feb 18, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/224
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for polishing a plurality of workpieces is disclosed. The method and system comprises providing a polishing tool with multiple polishing heads; and providing a substrate tray that can hold the plurality of work pieces in a fixed position on a tray underneath the polishing heads. The system and method includes moving the tray within the polisher. Finally, the method and system includes configuring the multiple polishing heads with the appropriate pad/slurry combinations to polish the workpieces and to create a finished polished surface on the plurality of work pieces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.