High-temperature ultrasonic sensor
US11268936B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2018 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Apr 23, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2634
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the first and second signals between the transducer and the DSI, the elongated member being configured to offset the low-temperature portion a sufficient distance away from the high-te…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.