Electronic device with a cover assembly having an adhesion layer
US11269374B2 · kind B2 · utility
0Cited by
60References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2020 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Aug 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/0283
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cover assembly for an electronic device has a cover member including a glass ceramic material. An adhesion layer couples an interior coating to the cover member. The adhesion layer includes an oxide-based layer, such as a silicon oxide-based layer, and a coupling agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.