Apparatus and methods for mass transfer of electronic die
US11270897B2 · kind B2 · utility
3Cited by
48References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2020 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Feb 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and associated method for high speed and/or mass transfer of electronic components onto a substrate comprises transferring, using an ejector assembly, electronics components (e.g., light emitting devices) from a die sheet onto an adhesive receiving structure to form a predefined pattern including electronic components thereon, and then transferring the electronic components defining the predefined pattern onto a substrate (e.g., a translucent superstrate) for light emission therethrough to create a high-density (e.g., high resolution) display device utilizing, for example, mini- or micro-LED display technologies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.