Method and device for treating substrates
US11270901B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Jan 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67706
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device treats substrates with a liquid, which device has a conveying device by which the substrates can be conveyed in a conveying direction through a container containing a liquid. A weir has an edge over which the substrates can run and which, at least in sections, extends obliquely relative to the conveying direction of the substrates. The weir is used in the device for treating substrates with a liquid. The weir has at least one edge which extends obliquely at least in sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.