Patent · US Active

Method and device for treating substrates

US11270901B2 · kind B2 · utility

0Cited by
4References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 26, 2019
Grant dateMar 8, 2022
Priority date
Expiry dateJan 30, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67706
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A device treats substrates with a liquid, which device has a conveying device by which the substrates can be conveyed in a conveying direction through a container containing a liquid. A weir has an edge over which the substrates can run and which, at least in sections, extends obliquely relative to the conveying direction of the substrates. The weir is used in the device for treating substrates with a liquid. The weir has at least one edge which extends obliquely at least in sections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.