Copper interconnect cladding

US11270943B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Flavio Griggio · Portland, US
• Philip Yashar · Portland, US
• Anthony V. Mule · Portland, US
• Gopinath Trichy · Portland, US
• Gokul Malyavanatham · Hillsboro, US

Key dates

• Filing date: Mar 27, 2018
• Grant date: Mar 8, 2022
• Expiry date: Jul 6, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D89/00
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit includes: a front end of line (FEOL) circuit including a transistor; and a back end of line circuit above the FEOL circuit and including insulator material having an interconnect feature therein. The interconnect feature includes: a core including copper; a first layer between the insulator material and the core, the first layer being distinct from the core; a second layer between the first layer and the core, the second layer being distinct from the first layer and the core, the second layer including a first metal and a second metal different from the first metal; and a capping member on the core and the second layer, the capping member including the second metal. In an embodiment, the first metal and the second metal are part of a solid solution in the second layer. In an embodiment, the first metal is ruthenium and the second metal is cobalt.