Germanium on insulator for CMOS imagers in the short wave infrared
US11271028B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2019 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Feb 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/337
Abstract
Light detecting structures comprising germanium (Ge) photodiodes formed in a device layer of a germanium on-insulator (GeOI) wafer, focal planes arrays based on such Ge photodiodes (PDs) and methods for fabricating such Ge photodiodes and focal plane arrays (FPAs). An FPA includes a Ge-on-GeOI PD array bonded to a ROIC where the handle layer of the GeOI layer is removed. The GeOI insulator properties and thickness can be designed to improve light coupling into the PDs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.