Integrated system with power management integrated circuit having on-chip thin film inductors
US11271071B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 2020 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Nov 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19106
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a substrate having a surface and a thin film inductor formed on top of the surface of the substrate and having a conductive wire, a first stack of magnetic layers and a second stack of magnetic layers. The conductive wire is disposed between the first and second stacks of magnetic layers, and the thin film inductor is configured to provide a magnetic field in the first and second stacks of magnetic layers in response to a current passing through the conductive wire. The first stack of magnetic layers has a first edge portion extending in parallel with a longitudinal axis of the conductive wire, and the second stack of magnetic layers has a second edge portion that covers the first edge portion conformally and is separated from the first edge portion by an insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.