OLED package structure, OLED device, display device and method for fabricating OLED package structure
US11271184B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2018 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Dec 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8794
Abstract
The present disclosure provides an OLED package structure, OLED device, display device and method for fabricating OLED package structure. The OLED package structure includes a substrate, a cover plate and a first sealant layer. The substrate, the cover plate and the first sealant layer together delimiting a sealed space. The OLED package structure further includes a functional sealant layer formed by filling the sealed space with a functional sealant, and a second sealant layer formed by a second sealant disposed between the substrate and the functional sealant layer. The second sealant has a density less than a density of the functional sealant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.