Conductive transfer
US11272580B2 · kind B2 · utility
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2References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2019 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Jul 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/036
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive transfer 201 for application to a surface includes two non-conductive ink layers 202, 203. A heating element 204 is positioned between the two non-conductive ink layers. An adhesive layer 207 for adhering said conductive transfer to a surface is also present. The heating element comprises an electrically conductive ink 205 having a positive temperature coefficient such that the electrically conductive ink exhibits an increase in resistance in response to an increase in temperature. A method of production of the conductive transfer involves a printing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.