Substrate and method for fabricating flexible electronic device and rigid substrate
US11272621B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2019 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Jan 26, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.