Method for producing circuit board and method for producing integrated circuit including the same
US11272622B2 · kind B2 · utility
1Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2019 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Oct 30, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a circuit board includes providing a substrate on which a toner image formed of a thermoplastic toner has been formed and forming a conductive foil layer having a thickness of 0.1 μm to 2 μm on the toner image that has been formed on the substrate and then applying heat to the toner image and the conductive foil layer to form a wire constituted by conductive foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.