Heat dissipation panel, heat dissipation apparatus, and electronic device
US11272639B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2017 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Nov 3, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1616
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.