Mounting bracket having electrical and thermal properties
US11272641B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2020 |
| Grant date | Mar 8, 2022 |
| Priority date | — |
| Expiry date | Mar 19, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2605/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Example embodiments described in this disclosure are generally directed to a mounting bracket for deployment in a vehicle. In one embodiment, a multilayer mounting bracket includes a first layer made of a dual-conductive polymer and a second layer made of a polymer that includes an endothermic blowing agent. The dual-conductive polymer includes carbon material that renders the first layer electrically conductive and also includes graphite material that renders the first layer thermally conductive. The endothermic blowing agent renders the second layer thermally insulative. An electronic module such as an engine controller can be mounted upon the first layer, which operates as a heat sink to dissipate heat generated by the electronic module and also operates as an electromagnetic interference (EMI) shield. The second layer prevents heat from being transferred from the first layer into another electronic module that may be mounted upon the mounting bracket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.