Aluminum alloy powder formulations with silicon additions for mechanical property improvements
US11273489B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | May 3, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2999/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The mechanical properties and thermal resistance of a sintered component made from an Al—Cu—Mg—Sn alloy powder metal mixture can be improved by doping the Al—Cu—Mg—Sn alloy powder metal mixture with a silicon addition. Silicon is added as a constituent to the Al—Cu—Mg—Sn alloy powder metal mixture. The Al—Cu—Mg—Sn alloy powder metal mixture is compacted to form a preform and the preform is sintered to form the sintered component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.