Asymmetric surface layer for floor panels
US11273897B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2018 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Apr 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/026
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
A heater panel includes a core. A heater/dielectric layer including a positive thermal coefficient (PTC) heater layer between a pair of dielectric layers is bonded to the core in a stack. An impact layer is bonded to the stack, wherein the impact layer includes a first sub-layer for impact absorption that is bonded to the stack and a second sub-layer for cut resistance bonded to the first sub-layer. The second sub-layer has a higher material hardness than that of the first-sub layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.