Placement method
US11274002B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2020 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Oct 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01M10/0585
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A placement method using a placement device provided with a first process of pressing a transfer plate a topmost layer sheet member so as to pick up it when a restraint device is rendered a restraining state, a second process of rendering the restraint device a non-restraining state to render the transfer plate an inclined state while pressing down the plurality of sheet members from above in the stacking direction by a base end part side of the transfer plate rendered the inclined state, a third process of inserting the restraining blade into the space formed between the topmost layer sheet member and the sheet member of the layer below it and again render the restraint device the restraining state, and a fourth process of making the transfer plate retract upward while returning it to the horizontal state and transferring the topmost layer sheet member to the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.