Polyamide compositions and plating applications thereof

US11274192B2 · kind B2 · utility

Assignee

• Ascend Performance Materials Operations LLC · US

Inventors

• Kimberly M. White · Baton Rouge, US
• Scott E. Powers · Fayetteville, US
• Jacob G. Ray · Milton, US
• Bradley J. Sparks · Richmond, US

Key dates

• Filing date: Jun 27, 2019
• Grant date: Mar 15, 2022
• Expiry date: Mar 11, 2040

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K2201/014
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form structurally aesthetic injection-molded articles. The polyamide compositions may include from 40 wt. % to 80 wt. % of a polyamide, from 0.5 wt. % to 40 wt. % of an etchable filler, from 5 wt. % to 30 wt. % of glass fiber, optionally less than 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance and excellent mechanical properties to injection-molded articles that are substantially free of visual defects.