Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair
US11274234B2 · kind B2 · utility
2Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2019 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Mar 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is an adhesive composition for temporarily bonding a semiconductor workpiece and support carrier pair with improved adhesive film properties. The adhesive composition may include one or more polymer resins, solvents, and a small but critical quantity of surfactants, among others. In operation, the one or more surfactants may improve film continuity, leveling, and reduce voids and defects. Sample semiconductor workpiece includes a semiconductor silicon wafer and sample support carrier includes rigid semiconductor silicon or glass, sapphire or other rigid materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.