Patent · US Active

Sputter devices and methods

US11274364B2 · kind B2 · utility

0Cited by

5References

18Claims

0Family size

Assignee

Solayer GmbH · DE

Inventors

Martin Portka · Wörth am Main, DE
Markus Kress · Mühlheim am Main, DE
Michael Geisler · Apolda, DE
Florian Schwarz · Fürth, DE

Key dates

Filing date	Jun 27, 2018
Grant date	Mar 15, 2022
Priority date	—
Expiry date	Aug 21, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/3323
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

Sputter devices comprise a vacuum supply, a gas supply, a substrate holding device, and sputter sources. Each sputter source is held by an individual source support, each of which has an individual reference point allocated on a sputter surface facing the deposition area, and each of which has a source distance to a source reference surface from the individual reference point. The sputter sources are spaced apart from each other, are arranged as a two-dimensional array opposite the deposition area, and extend along the source reference surface. The source reference surface is parallel to the substrate reference surface. At least one of the sputter sources has a source distance deviating from zero.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.