Patent · US Active

Systems, methods and file format for 3D printing of microstructures

US11275354B2 · kind B2 · utility

1Cited by
4References
36Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 24, 2021
Grant dateMar 15, 2022
Priority date
Expiry dateMar 24, 2041

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P90/02
  • WIPO fieldOther consumer goods
  • WIPO sectorOther fields

Abstract

Systems, methods, and new file formats are provided for printing 3D microstructures. In some implementations, a new file format is provided that defines 3D objects by a wireframe model expressed as a collection of wires. Because wires and their parameters are defined within the new file format, objects may be processed more efficiently and quickly to support 3D rendering operations. Such methods may be used to print new articles, such as eyelashes, bushes, swabs and other novel items.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.